L&T Semiconductor Technologies forms partnership to boost India’s AI data centre ecosystem
L&T Semiconductor Technologies (LTSCT) has signed an MoU with Azuremoto Technologies Inc., Taiwan, to advance Silicon Carbide and power semiconductor solutions for global markets, establishing a cross-border partnership to boost India’s AI data centre and semiconductor ecosystem.
The collaboration will focus on SiC MOSFETs, diodes and modules for AI Data Centres, as well as rectifiers and MOS-based semiconductor solutions for several applications.
Joint market development will target AI Data Centres, OEMs, ODMs and power solution providers. Mutual technical support will be given through reference designs, engineering samples, evaluation kits and application documentation. The partnership brings long-term collaboration on supply arrangements, product customisation, demand forecasting and potential co-development opportunities.
Both companies will establish a Definitive Agreement covering distribution, supply or joint development by next year. LTSCT will provide product roadmaps, technical expertise, engineering samples and compliance support, while Azuremoto will lead market development, customer engagement, first-line technical support and joint marketing initiatives.
This partnership reinforces LTSCT’s commitment to building a robust semiconductor ecosystem and delivering innovative power solutions for the fast-growing AI, energy and industrial sectors.
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CHIPLET CONNECT
LTSCT has joined imec’s Automotive Chiplet Programme (ACP), a pre-competitive research initiative bringing together stakeholders across the global automotive value chain.
Traditional monolithic System-on-a-Chip designs struggle to meet the compute and bandwidth demands of advanced driver-assistance systems, software-defined vehicles and next-generation in-vehicle infotainment.
Chiplets are modular silicon building blocks optimised for specific functions and connected through advanced 2.5D and 3D packaging. They offer higher performance per watt, faster time-to-market, greater supply-chain resilience and improved energy and spatial efficiency.
Transitioning to chiplet architectures is prohibitively expensive if pursued by individual OEMs. The ACP, which leverages imec’s world-leading expertise in advanced 2.5D and 3D packaging, builds the industry-wide alignment needed around interoperable chiplet standards, reducing vendor lock-in and improving supply-chain flexibility in the process.
LTSCT will contribute to safety-critical compute partitions, high-bandwidth die-to-die links, and test and monitoring frameworks spanning wafer fabrication through in-field operation. It will cover qualification, diagnostics and life-cycle management in real automotive environments – and focus on meeting functional safety and reliability requirements.
This reinforces India’s growing role in the global semiconductor ecosystem, with LTSCT contributing to open chiplet standards alongside leading automotive and technology innovators worldwide.
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SIMULATION SOFTWARE
L&T Semiconductor Technologies inks agreement to strengthen advanced power electronics design capabilities
To strengthen its advanced power electronics design capabilities, L&T Semiconductor Technologies (LTSCT) has signed a multi-year license agreement with Synopsys, a leader in engineering solutions from silicon to systems.
LTSCT will adopt Synopsys’s simulation software to accelerate AI-enabled design and optimisation of next-gen power modules and intelligent power modules. The collaboration integrates simulation, physics-based modelling and data intelligence across the design workflow, enhancing design efficiency, improving reliability and reducing development cycles.
As voltage levels scale from 1.2 kV to 10 kV, advanced modelling that integrates material science, metallurgical, thermo-mechanical and electro-mechanical properties becomes essential.
AI-enabled simulation supports optimisation across electrical, thermal and mechanical domains at chip, package and system levels concurrently, with AI-accelerated multiphysics modelling improving design robustness while reducing prototyping costs.
Following Synopsys’s acquisition of Ansys, the combined portfolio of multi-physics simulation technologies with AI-accelerated design platforms will support LTSCT’s work on integrated module architectures that combine power devices, gate drivers, protection circuits and control logic in compact form factors.
The collaboration will drive innovation across electric mobility, renewable energy and industrial automation, advancing the next generation of intelligent power solutions, thus reinforcing India’s position in the global power electronics and semiconductor design ecosystem.
